Low dielectric materials
We keep developing low dielectric materials for Next-generation mobile communication systems such as 5G,6G.
Our materials can help for reducing signal transmission loss in the semiconductor and substrate.
Features
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Particle size can be customized from submicro scale to micro scale.
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This material is low dielectric constant polymer beads and the characteristics was obtained by a resin of beads or by hollow structure.
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This material helps to increase the value on low dielectric constant of your application.
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We can customize the surface of this polymer beads in order to improve dispersibility when mixing into your application.
Gloss
| Structure | Average particle size(μm) | Dielectric properties | Heat registance(℃) | ||
| Dk | Df | Air | N2 | ||
| Solid type | 4、6 | Published in download document |
260 | 350 | |
| Hollowtype | 0.5,4,8 | 280 | 340 | ||
| Hollowtype (High heat registance) |
4,10 | 330 | 360 | ||
Applications
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Additive for semiconductor package or substrate
