TPCA Show 2025 Exhibition Report
SEKISUI KASEI participated in the "Taiwan Printed Circuit Association Show 2025"
Thanks to the many
visitors who joined us, the event was a great success and ended on a high note.
Outline of "TPCA 2025"
Dates : October 22 (Wed) - October 24 (Fri), 2025
Location : TaiNEX, Taiwan
Exhibition zone :
Materials/Chemicals Zone Booth Number: N-023
Our main displays : TECHPOLYMER( polymer particle)
Our Main Displays
Our company showcased newly developed materials such as
low-dielectric fine particles, hollow nanoparticles, and soft particles.
Low-Dielectric Particles
It is a resin filler with low dielectric properties, and is an additive with Dk3.0 and Df0.002 or less, which are required for 5G and 6G. Our lineup includes hollow types (non-foamed) with excellent low dielectric constants and solid types that are easy to handle.
Resin Engineering with Soft Low-Dielectric Particles
Designed to prevent warpage and cracking, this tough, low-dielectric material supports multilayer and thin-film technologies for next-gen electronics.
Hollow Polymer Particles NH Series
NH series is polymer particles which have hollow structure inside the nano-sized particles. By dispersing it in a coating, it can be used as a low refractive index material while maintaining transparency.
Exhibition Report
