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Low Dk / Low Df Polymer Particles

Overview

Low Dk / Low Df polymer particles designed for advanced electronic materials used in AI servers, data centers, and other high-speed communication applications where signal integrity is critical.
Available in both hollow and solid particle structures, these particles help reduce dielectric loss while providing excellent thermal stability and design flexibility for next-generation electronic materials.

Composition: Crosslinked Polystyrene-Based
Structure: Hollow / Solid
Particle Size: 0.3 μm, 0.6 μm, 4 μm
Td5: Approx. 300°C
Solvent Resistance: Excellent

Td5 : 5% Weight Loss Temperature

微粒子

Cross-Sectional Image of Hollow Particles

Features

・Excellent Dielectric Performance for High-Speed Communications
Low dielectric constant (Dk) and low dissipation factor (Df) help minimize signal transmission loss at high frequencies. Ideal for AI servers, data centers, semiconductor packaging materials, and next-generation communication systems.
・Improved Toughness and Stress Relief
Polymer particles enhance fracture toughness while improving durability, stress relaxation, and crack resistance in resin systems.
・High Heat Resistance and Design Flexibility
With heat resistance of approximately 300°C, the particles can be customized through hollow ratio control, surface modification, and flame-retardant design to meet diverse application requirements.

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Recommended Grades

・Hollow Type

Composition	Particle Structure	Particle Size (µm)	Dielectric Properties		Td5 (℃)
Composition	Particle Structure	Particle Size (µm)	Dk (10 GHz)	Df (10 GHz)	Air	N₂
Crosslinked Polystyrene	Hollow	0.6	1.61	0.0017	310	360
Crosslinked Polystyrene		4	1.65	0.0007	300	380
High Heat-Resistant Resin		4	1.53	0.0007	310	390

・Solid Type

Composition	Particle Structure	Particle Size (µm)	Dielectric Properties		Td5 (℃)
Composition	Particle Structure	Particle Size (µm)	Dk (10 GHz)	Df (10 GHz)	Air	N₂
Crosslinked Polystyrene	Solid	0.3	2.20	0.0011	290	370
Crosslinked Polystyrene		4	2.22	0.0007	300	390
High Heat-Resistant Resin		4	2.20	0.0007	310	390

Typical Applications

Additives for Semiconductor Packaging Materials Suitable for semiconductor packaging materials, electronic substrates, insulating materials, and other applications requiring low dielectric performance.
Electronic Materials for High-Speed Dat Transmission
- Signal loss reduction
- Impedance control
- Reduced skin effect loss
- High-frequency communication materials
- AI server and data center applications

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Particle Size Control(Micron, Submicron)
Particle Shape Configuration(Hollow structure, Porus structure, etc.)
Composition Variation(PET, Biodegradable, Biomass)
Particle Characteristic Control(Refractive index, Softness)
Stability Improvement(Solvent resistance, UV resistance, Heat resistance)
Functionality Improvement(Thermal Conductivity, Functional Group Addition)
Other Technologies
For Cosmetics

Soft Particle Series

Our wide range of products with different compositions offers particles with various softness. The particles increase scratch resistance and adds texture to the coating surface.

Particle Series for Cosmetic Products

Grades with residual monomers removed by advance purification processes are available for cosmetic applications. The spherical shape of the “TECHPOLYMER” can improve spreadability of foundations, create a soft-focus effect, and change the texture. Porous particles that can be used as adsorbents, and elastic particles that adds soft feel are also available.

Particle Size Control

“TECHPOLYMER” is available in the size from submicron, micron, and up to millimeter* sizes. The wide product range offers the most suitable size for your application.
* The millimeter sizes are available as a separate product called the “DUOMASTER”.

Particle Shape Configuration

We have successfully established shape configuration technology which enables the control of interior and exterior structure of the particles to develop non-spherical particles, hollow, and porous particles. Non-spherical particles are expected to obtain special optical properties from the special shapes in applications. The porous and hollow particles improve properties such as light diffusion, low permittivity, absorption. These particles are lower specific density according to the air voids within the structure.

Hollow Structure

Porous Structure

Highly Porous Cosmetic Particles

Biconvex Lenticular

Hemispherical

Hemispherical Particles（Monodisperse Type）

Other Non-Spherical

Composition Variation

Sekisui Kasei has developed various new “TECHPOLYMER” grades that offer new functions and features. We can also develop custom grades for Customer’s special needs. Please contact us to discuss your applications.

Particle Characteristic Control

“TECHPOLYMER” offers a wide range of grades with the properties controlled to suit various applications. For display applications (liquid crystal), many grades are offered by adjusting the refractive index of the particles in order to obtain the desired light diffusion effect. For paints and coatings, various grades are being used in which the hardness of the particles has been adjusted to improve the texture of the coating.

Stability Improvement

“TECHPOLYMER” grades to withstand harsher conditions with higher resistance are available.
Contributes to higher productivity and quality stability of the final product enabling a wider choice of material to use.

Functionality Improvement

Developing high functionality particles by compositing “TECHPOLYMER” with other functional materials.
Other than the functionality of the material, the following are expected from composited particles.

Improvement in handling
Improvement of dispersibility in the matrix
Reduction in the amount of additives

In addition, particles with the characteristics of both the “TECHPOLYMER” and the functional material can be created such as the following:

Anti-blocking property (“TECHPOLYMER”) and conductivity (conductive material)
Light diffusion (“TECHPOLYMER”) and wavelength control (wavelength control material)
Impact resistance (“TECHPOLYMER”) and conductivity (conductive material)

Other Technologies

Capable of customizing our products with various technologies to offer our customers more solutions for their product development.
The following are few examples of our technologies.
Other customizations maybe available, please do not hesitate to contact us.

For Cosmetics

For cosmetic applications, we offer grades that have been highly purified to remove residual monomers. Capable of customizing our products with various technologies to meet your needs. Please contact us.

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